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Femto Module v1

Highly miniaturized RP2040 12x12mm PCB module

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Femto is a ultra compact RP2040 module, which has features, as following:
- small footprint 12x12mm,
- all 30 GPIO pins connected,
- stamp form factor,
- 4-layer PCB board,
- onboard: QSPI Flash (USON8 package), 12MHz oscillator, PWR LED,
- fully open source project (OSHW),
- Kicad and Altium Designer files.

The main goal and reason to create this project was attempt to design smallest as possible, and fully functional RP2040 module. Please note, that RP2040 MCU nas 7x7mm package, and Femto module has only a bit more, 12x12mm. In comparision, closer competitiors, such as Raspberry Pi Pico or Stamp Solder RP2040 Party have appropriately 51x21mm and 25x25mm.

The project consists of 3 parts:
- module (mainboard),
- frame (solder frame),
- tester (testbench, only for functional verification).

All the source and manufacturing files you can download here:
https://github.com/mfolejewski/FEMTO

You can order PCB boards in JLCPCB factory with optional assembly service.

x-zip-compressed - 22.74 MB - 08/18/2022 at 22:40

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x-zip-compressed - 10.89 MB - 08/18/2022 at 22:39

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x-zip-compressed - 4.68 MB - 08/18/2022 at 22:39

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x-zip-compressed - 159.01 kB - 08/18/2022 at 22:39

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Discussions

zyndram wrote 06/08/2023 at 18:28 point

ale co to ułatwia? płyta główna powinna pobierac mało prądu i powinna miec choć trochę wygody. gdzie zasilanie lipo albo step-up np. od 0 do 5V wtedy możesz zasilać prawie dowolną baterią lipo 18650 itp. a nawet panelem słonecznym. np. https://1bitsquared.com/products/orangecrab ma zasilanie. I tak każde urządzenie musi być zasilane, kabel zawsze jest złym pomysłem. 

nie mówię o klawiaturze, jakimś ekranie. omiatanie klawiatury np. zajmuje mnóstwo czasu i prądu i zazwyczaj nie powinien to robić główny procesor. No chyba, że chcesz to potem wstawić do jakiegoś wiekszego sprzętu ja https://beepberry.sqfmi.com/ albo https://www.lilygo.cc/products/t-deck (który ma i tak 2040 do klawiatury właśnie)

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micl wrote 09/08/2022 at 05:29 point

Interesting choice to use a separate pcb as leads of a package, but do you think you could get it smaller? Another addition could be the module footprint exposing a grounded E-pad to heatsink the RP2040 from its package to the host PCB. 


Edit: This would mean not cutting out the center, but instead using thinner PCB stock material and completely enclosing the microcontroller.

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